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Automatic High-speed Precision Placement Equipment

Product introduction: The equipment is mainly used for automatic laminating equipment for buffer film, which integrates automatic loading and unloading, code scanning, height measurement, placement, X/Y re-inspection, NG discharge and other processes.
Application field: 3C electronics industry and related industries used in the placement process of micro components.
Support hotline: mkt@world-machining.com
Address:No. 6 Wanjiang Section, Gangkou Avenue, Wanjiang Subdistrict, Dongguan City, Guangdong Province, China. 523061

1. Fully automatic loading and unloading mechanism, automatic separation and switching mechanism of material tray, two sets of high-precision linear module handling, greatly improving equipment efficiency;

2. The combination of high-resolution camera and six-axis robot improves the accuracy and stability of placement;

3. The compact winding tape buffer glue feeding mechanism is used to make the structure more compact and improve the placement capacity;

4. The high-precision pressure sensor is used to monitor the pressure of the pressure head on the micro-buffer in real time, to avoid the pressure being too large or too small, and to ensure the safety and effectiveness of each pressure maintenance;

5. The buffer rubber is fed by the winding material belt, which makes the equipment structure compact;

6. The mounting height of the buffer glue is re-detected by high-precision line laser;